Process Engineer

Process Engineer
Hartlepool
Overview
Wolviston Management Services is supporting our amazing client in the recruitment of a Process Engineer to join their growing team.
Due to continued growth and investment in advanced packaging and assembly capability, they are expanding their Process Engineering function to support the transition of new technologies into stable, high-yield manufacturing.
The Role
This position will focus on the development, optimisation and control of advanced semiconductor module assembly processes, with a particular emphasis on die attach and wire/ribbon bonding technologies.
The successful candidate will play a key role in bridging development and production, ensuring processes are robust, scalable and capable of supporting future technology requirements.
Key Responsibilities Technology & Roadmap Development

• Collaborate with Engineering to identify and mature manufacturing technologies aligned to future product requirements
• Evaluate emerging assembly and interconnect technologies to support increased power density and frequency performance
• Assess manufacturability, scalability and cost implications of new technologies
• Lead feasibility trials and proof-of-concept activities
• Support supplier evaluation and make/buy decisions

Die Attach Process Engineering

• Develop and optimise processes including silver epoxy, silver sinter and eutectic attach (AuSn)
• Define process parameters (temperature, pressure, time and atmosphere)
• Deliver process validation, qualification and reliability testing
• Characterise bond performance including voiding, bond line thickness and thermal resistance
• Support material selection and supplier development

Wire Bonding Development

• Establish and optimise gold wire and ribbon bonding processes (ball and wedge)
• Define process parameters across varying substrates and metallisation types
• Perform mechanical testing (pull/shear) and reliability assessments
• Resolve bonding challenges including intermetallic formation and pad integrity
• Support fine-pitch and high-frequency assembly requirements

Manufacturing & Continuous Improvement

• Define, document and control manufacturing processes and workflows
• Develop SOPs, control plans and process documentation
• Monitor process capability (SPC, Cp/Cpk) and drive yield improvements
• Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA)
• Deliver continuous improvement initiatives targeting cost, quality and cycle time

New Product Introduction (NPI)

• Support DFM/DFA activities during product development
• Develop pilot builds and process validation strategies
• Work cross-functionally to ensure smooth transition into production
• Define tooling, fixturing and automation requirements

Requirements Essential

• Degree in Engineering, Materials Science, Physics or related discipline
• Experience in semiconductor or RF module manufacturing environments
• Hands-on experience with at least one of the following:
  • Silver epoxy die attach
  • Silver sintering
  • Eutectic die attach
  • Gold wire bonding
• Strong understanding of materials behaviour and thermal management
• Experience in process validation and statistical analysis
• Proven problem-solving capability within a manufacturing setting

Desirable

• Background in high-precision electronics, automotive or power electronics manufacturing
• Experience in high-tech or semiconductor production environments
• Knowledge of RF packaging and JEDEC standards
• Experience with equipment specification and commissioning
• Familiarity with thermomechanical modelling and reliability testing
• Understanding of ISO 9001 or IATF 16949 quality systems

Key Attributes

• Analytical, structured and detail-oriented approach
• Strong cross-functional collaboration skills
• Ability to translate technical requirements into practical manufacturing solutions
• Hands-on and proactive within a production environment
• Comfortable working across both development and operations
• Capable of managing priorities in a fast-paced, scaling organisation